3M EPS-300 3 to 1 Adhesive Lined Heat Shrinkable Tubing
Please Note - due to instability in 3M pricing, we recommend you contact us prior to purchasing. Or consider our high quality, lower cost, in stock BuyHeatShrink 3:1 Adhesive lined Heat Shrink Tubing
Features:
3:1 Shrink Ratio with melt adhesive inner lining (shrinks to 1/3 its original diameter)
Up to 15% longitudinal shrinkage
Meets requirements of AMS-DTL-23053/4 (formerly MIL-I-23053/4), Class 3
UL 224 VW-1 and CSA OFT recognized
Maximum use temperature 135°C
Shrink Temperature of 90°C and operating temperature of -55°C to + 110°C
Crosses to : Sumitomo W3B2, Raychem ATUM, Alpha FIT-321, 3M EPS-300, Canusa CPA-100 , LG GSHS-3635W
Typical applications include: Insulation, Wire Identification, Wire Bundling, Mechanical Protection, Color Coding, Lightweight Harnessing, Physical/Electrical Protection of Components, Strain Relief, and Solder Insulation.
Comparison between 3M and BuyHeatShrink 3:1 Thin Wall Adhesive Lined Heat Shrink Tubing
Compare:
3M
BuyHeatShrink
SKU
EPS300
HS3A
Cancellable/Refundable
No
Yes
Colors Available
Black, Red
Black,Clear, Blue, White and Yellow, and Orange( select Sizes)
Our 3:1 heat shrink tubing is also available with a "dual-wall" construction. When exposed to heat (usually a bit lower than the activation temperature of the heat shrink), the inner layer begins to flow (just like a hot melt glue). When the tubing shrinks and cools down, inner layer forms an adhesion layer between the tubing and the component or wire. This provides a water-tight seal, protecting the connector and/or wire.
Features:
3:1 Shrink Ratio with melt adhesive inner lining (shrinks to 1/3 its original diameter)
Up to 15% longitudinal shrinkage
Meets requirements of AMS-DTL-23053/4 (formerly MIL-I-23053/4), Class 3
UL 224 VW-1 and CSA OFT recognized
Maximum use temperature 135°C
Shrink Temperature of 90°C and operating temperature of -55°C to + 110°C
Crosses to : Sumitomo W3B2, Raychem ATUM, Alpha FIT-321, 3M EPS-300, Canusa CPA-100 , LG GSHS-3635W
Typical applications include: Insulation, Wire Identification, Wire Bundling, Mechanical Protection, Color Coding, Lightweight Harnessing, Physical/Electrical Protection of Components, Strain Relief, and Solder Insulation.